Harry is a registered Patent Agent with an extensive background and over ten years of diverse experience in fiber optics, fine particle, advanced materials and processing technology.

Before joining TPL, Harry held senior level technical positions with LaserComm and Corning. At LaserComm, he was credited with designing fiber optic devices for dispersion compensation in telecommunications and for developing methods for fabricating special optic fibers. At Corning, he established new processing methods for optical materials in his position there as a senior researcher.

Prior to his career in industry, Harry performed research in the area of chemical engineering, and particular in paper making, heat transfer and interfacial phenomena. During his time in academic institutions, Harry co-authored over ten technical publications. He also taught process control when he was a postdoctoral associate in State University of New York in Syracuse.

With significant R&D and product development experience, as well as an international background, Harry acts as an technical liaison between TPL and some of its international clients. He speaks fluent Mandarin and Cantonese Chinese.

Harry holds a B.S. and M.S. in Chemical Engineering from the South China University of Technology and Ph.D. in Chemical Engineering from Clarkson University in New York. He holds five U.S. patents and one Taiwanese patent.

Phone: 215.766.2100, ext.107
Fax: 215.766.2920
Email: hwei@techpats.com